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ICSCRM
27 September 2026 – 02 October 2026
Yokohama, Japan – Pacifico Yokohama North
Booth # A-06
The world’s leading technical conference on silicon carbide
ICSCRM focuses on the latest advances in silicon carbide and other wide bandgap semiconductors, addressing topics including crystal growth, material characteristics, device manufacturing for power switching, RF applications, and high-temperature devices, along with packaging technologies and system applications. This prestigious event gathers leading researchers, industry professionals, and academics from around the globe to discuss the latest developments and advancements in silicon carbide technology and its related materials.
ICSCRM 2026 marks the 23rd edition of the conference, returning to Japan and welcoming the global SiC community for a week of technical presentations, interactive discussions and networking across academia and the industry.
Visit Vibrantz and Pureon at ICSCRM 2026
Vibrantz will be co-exhibiting at ICSCRM 2026 alongside our distribution partner, Pureon, bringing our SiC polishing slurry portfolio directly to the world’s foremost gathering of SiC materials professionals. Our team will be available throughout the conference to discuss our slurry solutions and explore how they can support your wafer polishing process — from development through high-volume production.
Stop by Booth# A-06 our shared exhibit to connect with our experts and learn more about what Vibrantz and Pureon can offer your operation.
Featured products
Precision polishing for the future of SiC wafers
Vibrantz’s SiC polishing slurries deliver precise chemical mechanical planarization (CMP) for SiC wafers, with consistent removal rates and low defectivity across evolving wafer sizes. With nearly 15 years of formulation expertise, we co-develop solutions tailored to each customer’s unique specifications — backed by a robust database of proven formulations and performance data.
Our portfolio includes both permanganate-based and abrasive-free chemistries designed to meet the demands of high-volume SiC substrate production, where surface quality, throughput, and process cleanliness all matter.
SiC Slurry – SRS2550 abrasive-free slurry
SRS2550 delivers ultra-clean, high-performance SiC polishing with zero abrasives. Its near-neutral chemistry and consistent removal rates up to 6 μm/hr make it well suited for high-volume runs, with a surface finish under 0.8 Å and up to 99% usable wafer area. By eliminating abrasive particles, SRS2550 reduces line sediment, cuts cleaning cycles, and minimizes downtime.