Surface Finishing and Chemical Mechanical Planarization (CMP) Materials

Our high-performance zirconium oxide glass polishing products designed to deliver excellent performance for relatively soft ophthalmic and precision optic substrates including digital camera lenses and blue filter glass.

We offer zirconia polishing products available as dry powders and aqueous slurries with excellent suspension characteristics to ensure a consistent polishing performance from batch to batch.

Our zirconium oxide-based glass polishing powders and slurry formulations are developed with application-based tailored properties with tightly controlled particle size distribution to ensure a consistent high-quality surface finish with easy cleaning of polish particles.

Zox® is Vibrantz’s range of zirconium oxide slurries formulated for precision glass polishing of optical lenses, digital camera lenses, phosphate glass and ophthalmic lens polishing.

We are a leading global manufacturer of optimized high-purity tungsten CMP slurries designed to deliver optimal performance in metal CMP applications. The tungsten CMP slurry product line offers a wide range of aqueous tungsten slurries that achieve optimal metal CMP removal rates, resulting in decreased cost of ownership with increased productivity using existing equipment and space.

We offer optimized high-purity cerium oxide-based polishing slurries designed to deliver optimal bulk oxide removal in dielectric CMP applications. We offer a wide range of cerium oxide aqueous slurries that achieve optimal dielectric CMP oxide removal rates resulting in decreased cost of ownership and increased productivity using existing equipment and space.

TruPlane 1731 is a fast oxide slurry used in applications such as 3D NAND and MEMS where large amounts of oxide removal are required. It is the next generation product following our Truplane^® 1631 slurry product line.

Comprised of an engineered ceria particle and a novel accelerant, TruPlane 1731 is optimized to give high removals for superior defectivity. It can also be diluted depending upon process requirements.

We are a leading global manufacturer of TruPlane^® optimized high-purity cerium oxide-based polishing slurries designed to deliver optimal bulk oxide removal in dielectric CMP applications. We offer a wide range of cerium oxide aqueous slurries that achieve optimal dielectric CMP oxide removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space. A tightly controlled particle distribution and large particle counts (LPCs) ensures low-defectivity polishing.

TruPlane^® 1631 is a fast oxide slurry used in applications such as 3D NAND and MEMS where large amounts of oxide removal are required. It is comprised of an engineered ceria particle and a novel accelerant optimized to give high removals for superior defectivity.

Vibrantz manufactures a diverse portfolio of high purity silica-based aqueous slurries and suspensions designed for polishing sapphire substrates used in LEDs, camera lens covers, and fingerprint sensor covers. Our offering of silica-based polishing compounds are used for sapphire substrates. Our SN7010 silica slurry products are fully formulated to deliver excellent polishing results for sapphire substrates.

Our optimized high-purity CMP cleaners are designed to deliver optimal performance in post copper cleans for metal CMP applications. The GC14200 series is a line of advanced cleaners for post copper CMP processes that combines excellent cleaning performance with maximum copper surface protection.

We offer optimized high-purity copper CMP slurries designed to deliver optimal performance in metal CMP applications. The Vibrantz copper CMP slurry product line offers a wide range of aqueous slurries that achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space.

Vibrantz is a leading global manufacturer of optimized high-purity copper barrier slurries designed to deliver optimal performance in metal CMP applications. Our line of copper barrier CMP slurries provides a wide range of aqueous copper barrier slurries designed to remove the barrier metals that are exposed following copper clearing. Our copper barrier CMP slurries achieve optimal metal CMP removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space.

SN4501 copper barrier CMP slurries feature a tunable removal rate for copper barrier and oxide with linear response to downforce.

Selectivity is also tunable for copper/TEOS which allows a good oxide loss control and results in low surface roughness.