We offer optimized high-purity slurries with excellent stability designed for CMP polishing wafers for reclaim processing. Our wide range of alumina-based CMP slurries for polishing reclaims wafers provide a better polishing capability for complex hard films with high throughput. Ideal for mechanical polishing, our slurries have a good surface roughness that delivers low defectivity.

Our CMP slurries achieve optimal metal CMP removal rates and have excellent shelf life, resulting in decreased cost of ownership and increased productivity using existing equipment and space.