We are a leading global manufacturer of TruPlane^® optimized high-purity cerium oxide-based polishing slurries designed to deliver optimal bulk oxide removal in dielectric CMP applications. We offer a wide range of cerium oxide aqueous slurries that achieve optimal dielectric CMP oxide removal rates, resulting in decreased cost of ownership and increased productivity using existing equipment and space. A tightly controlled particle distribution and large particle counts (LPCs) ensures low-defectivity polishing.

TruPlane^® 1631 is a fast oxide slurry used in applications such as 3D NAND and MEMS where large amounts of oxide removal are required. It is comprised of an engineered ceria particle and a novel accelerant optimized to give high removals for superior defectivity.