We offer optimized high-purity cerium oxide-based polishing slurries designed to deliver optimal bulk oxide removal in dielectric CMP applications. We offer a wide range of cerium oxide aqueous slurries that achieve optimal dielectric CMP oxide removal rates resulting in decreased cost of ownership and increased productivity using existing equipment and space.

TruPlane 1731 is a fast oxide slurry used in applications such as 3D NAND and MEMS where large amounts of oxide removal are required. It is the next generation product following our Truplane^® 1631 slurry product line.

Comprised of an engineered ceria particle and a novel accelerant, TruPlane 1731 is optimized to give high removals for superior defectivity. It can also be diluted depending upon process requirements.